Material-Specific Preparation Guide

Grinding: Start with 120 grit SiC, progress through 240, 400, 600 (800 and 1200 optional for high-quality work or high-magnification analysis)

Polishing: 9μm → 3μm → 1μm diamond, final with 0.05μm colloidal silica

Etching: 2-5% Nital or Picral, depending on structure to reveal

Notes: Standard preparation sequence, adjust grits based on hardness. Use 800/1200 grit for very fine finishes or when preparing for high-magnification analysis.

Grinding: Start with 120 grit, progress through 240, 400, 600 (800 and 1200 optional for high-quality work or high-magnification analysis)

Polishing: 9μm → 3μm → 1μm diamond, final with 0.05μm colloidal silica

Etching: Vilella's Reagent, Adler's, or Kallings No. 2 depending on grade

Notes: Work-hardening material, use consistent moderate pressure. Use 800/1200 grit for very fine finishes or high-magnification analysis.

Grinding: Start with 120 grit, progress through 240, 400, 600

Polishing: 9μm → 3μm → 1μm diamond, final with 0.05μm colloidal silica

Etching: Keller's Reagent or Al-NaOH etchant

Notes: Soft material, use shorter times and lighter pressure to avoid smearing