CU-PASS-SOL
material specific
Composition
CuSO₄, NH₄OH, H₂O
Mixed
Method
immersion
Time
30s
Basic Information
Category:Material Specific
Composition:CuSO₄, NH₄OH, H₂O
Concentration:Mixed
Reveals:Grain boundaries, twinning
Typical Results:For copper and copper alloys. Reveals grain structure.
Color Effects:Grain boundaries dark
Available from PACE Technologies
This etchant is available as a ready-to-use product.